JPH0286194U - - Google Patents
Info
- Publication number
- JPH0286194U JPH0286194U JP16714288U JP16714288U JPH0286194U JP H0286194 U JPH0286194 U JP H0286194U JP 16714288 U JP16714288 U JP 16714288U JP 16714288 U JP16714288 U JP 16714288U JP H0286194 U JPH0286194 U JP H0286194U
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- core plate
- clad sheet
- material layer
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 3
- 229910052782 aluminium Inorganic materials 0.000 claims 3
- 239000000956 alloy Substances 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000005096 rolling process Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16714288U JPH0537491Y2 (en]) | 1988-12-23 | 1988-12-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16714288U JPH0537491Y2 (en]) | 1988-12-23 | 1988-12-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0286194U true JPH0286194U (en]) | 1990-07-09 |
| JPH0537491Y2 JPH0537491Y2 (en]) | 1993-09-22 |
Family
ID=31455171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16714288U Expired - Lifetime JPH0537491Y2 (en]) | 1988-12-23 | 1988-12-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537491Y2 (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003086747A (ja) * | 2001-09-10 | 2003-03-20 | Hitachi Ltd | 絶縁回路基板とその製法およびそれを用いた半導体パワー素子 |
| JP2012117110A (ja) * | 2010-12-01 | 2012-06-21 | Showa Denko Kk | アルミニウムろう付品の製造方法 |
-
1988
- 1988-12-23 JP JP16714288U patent/JPH0537491Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003086747A (ja) * | 2001-09-10 | 2003-03-20 | Hitachi Ltd | 絶縁回路基板とその製法およびそれを用いた半導体パワー素子 |
| JP2012117110A (ja) * | 2010-12-01 | 2012-06-21 | Showa Denko Kk | アルミニウムろう付品の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0537491Y2 (en]) | 1993-09-22 |
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